Danfoss launches CoolTrain™ for data centre liquid cooling applications

DUBAI, UAE, March 26, 2026: Danfoss said it has launched the Danfoss CoolTrain™, which it described as a modular pre-engineered and factory-tested valve train subsystem designed to address energy efficiency and deployment risks in direct-to-chip liquid cooling. Making the announcement through a Press Release, the company said the solution is intended to support the transition towards liquid cooling driven by AI and high-density computing.

Danfoss said the CoolTrain™ replaces on-site assembly with a plug-and-play solution. The company added that the system is designed to accelerate project timelines and optimise system performance from the outset.

Danfoss said traditional on-site assembly of liquid cooling systems is a source of inefficiency. The company added that manually assembled systems are often not dynamically hydronic balanced, which it said leads to increased energy use from pumps. Danfoss said such methods are also prone to errors and may introduce risks of leaks and contamination, which it said can affect data centre operations.

Moath Shanaah, Data Center Business Development Manager, Danfoss – Türkiye, Middle East and Africa, said: “We saw the immense pressure our customers are under. They need to deploy liquid cooling fast and at scale, but the traditional methods are holding them back with risks and inefficiency. The CoolTrain™ is our direct answer to this. It’s about replacing on-site variables with factory-guaranteed certainty. We want to empower engineers to go with the smart flow, confident that their system is efficient and leak-proof from the moment it’s connected.”

Danfoss said the CoolTrain™ is a modular subsystem designed to connect facility cooling loops with server racks. The company added that each unit is assembled in a factory environment, pressure-tested, internally cleaned to ISO standards, pre-filled with coolant and sealed prior to delivery.

Danfoss said this approach reduces installation time and addresses causes of cooling system failures. The company added that the system integrates components intended to support reliability, hydronic balancing and digital monitoring.

Danfoss said the solution incorporates features such as interlockable couplings and flexible hoses to reduce leakage risks. The company added that the system includes a pressure independent control valve designed to provide continuous hydronic balancing.

Danfoss said the system can be equipped with a digital actuator to provide operational data, including flow rates and temperatures. The company added that this capability supports remote optimisation and predictive maintenance.

Danfoss said the CoolTrain™ supports specified operating parameters, including flow capacity, pressure and temperature ranges, and is designed for high-density rack cooling applications. The company added that the solution is available for specification in data centre projects.